发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR FILM, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF ELECTRONIC APPARATUS, SEMICONDUCTOR FILM, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a silicon carbide film (semiconductor film) improved in characteristics. SOLUTION: The manufacturing method of the semiconductor film includes: a first process of forming a first silicon carbide film 3 on a silicon film by supplying a carbon source gas onto the first silicon film S1; a second process of forming a second silicon film 5 on the first carbon silicon film; a third process of irradiating the second silicon film with laser beams; and a fourth process of forming a second silicon carbide film by supplying a carbon source gas and a silicon source gas onto the first silicon carbide film after the third process. By this method, the first silicon carbide film 3 can be reformed through the irradiation of the laser beams to improve characteristics of the second silicon film grown on the film. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009188133(A) |
申请公布日期 |
2009.08.20 |
申请号 |
JP20080025632 |
申请日期 |
2008.02.05 |
申请人 |
SEIKO EPSON CORP |
发明人 |
SHIMADA HIROYUKI |
分类号 |
H01L21/205;H01L21/20;H01L21/336;H01L29/12;H01L29/161;H01L29/47;H01L29/78;H01L29/872 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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