| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin solid-state imaging device with high rigidity, accuracy, and reliability. <P>SOLUTION: The solid-state imaging device comprises a flexible wiring board 1 having an opening, a solid-state imaging element substrate 10 flip-chip mounted on the flexible wiring board 1, and a resin mold frame part 18 formed on a rear surface of the solid-state imaging element substrate 10. A surface of the flexible wiring board 1 with the solid-state imaging element substrate 10 mounted thereon is covered with a resin mold frame part 18 while exposing a part of the rear surface of the solid-state imaging element substrate 10. <P>COPYRIGHT: (C)2009,JPO&INPIT |
