发明名称 POLYCONDENSATION COMPOUND AND POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a polycondensation compound containing no halogen atom in its backbone, being highly sensitive, not undergoing swelling of a relief pattern due to a developer such as a 2.38% tetramethyl ammonium hydroxide aqueous solution that is generally used in a production process of a semiconductor device, having good solvent resistance of a relief pattern after thermosetting, and being soluble in a &gamma;-butyrolactone solvent before thermosetting. <P>SOLUTION: The polycondensation compound is represented by general formula (1), wherein X<SB>1</SB>, X<SB>2</SB>, and X<SB>3</SB>each denote a divalent organic group containing no halogen atom, may be the same or different, and t and u each independently denote an integer between 1 and 100. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009185255(A) 申请公布日期 2009.08.20
申请号 JP20080029221 申请日期 2008.02.08
申请人 ASAHI KASEI E-MATERIALS CORP 发明人 KANEDA TAKAYUKI;NIWA MOTOHIRO;SHIBUI TOMOHITO;SASAKI YUKA
分类号 C08G73/22;G03F7/023;G03F7/40;H01L21/027 主分类号 C08G73/22
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