| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit device that can efficiently dissipate heat of various kinds of components and members existing in positions isolated from a heat dissipation substrate. SOLUTION: On the top surface of an electrically insulating layer 2 formed on a heat dissipation substrate 1, a heat conductive sheet member 4 is formed, which is arranged in isolation from a plurality of circuit patterns 3 or a circuit pattern 3. An isolation circuit member 5 includes an electrical connection portion 51 that is electrically connected to a circuit pattern 3, an isolation portion 52 that is arranged in isolation from the circuit pattern 3, and a connection portion 53 that connects the electrical connection portion 51 to the isolation portion 52. Between the isolation portion 52 and heat conductive sheet member 4, a thermal conductive member 6 of pillar shape or block shape is arranged. COPYRIGHT: (C)2009,JPO&INPIT |
