| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board which prevents the occurrence of uneven stresses in the inside and on the outside of a through-hole caused by temperature environmental change and which is capable of improving the product reliability and reducing the production cost, and to provide a manufacturing method therefor. <P>SOLUTION: In the through-hole 4 of the multilayer printed circuit board P1, an insulation material 8 whose Young's modulus is lower than that of resin impregnated in a prepreg is embedded, so that the regulation of properties, such as, reliability with respect to the change in the temperature environmental can be maintained low, and the occurrence of an uneven stress inside and outside the through-hole 4 with respect to the temperature environmental change can be prevented. Also, since the need for the prepreg resin to be poured into the through-hole 4 can be dispensed with, there is no need for the number of the prepregs to be increased, even when a metal core 1 is thick or when the number of the through-holes 4 is large. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
