发明名称 SUBSTRATE MANUFACTURING METHOD AND SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a substrate manufacturing method high in productivity and surely preventing scattering of fine dust from an outer peripheral face of an end face of a substrate body and the substrate. SOLUTION: Two holes 12 are formed in a substrate forming region of an insulating substrate material 10, insulating members 6 are embedded in the two holes 12 to form a coupling part, two slots 13 with their both ends reaching the holes 12 with the insulating members 6 embedded are formed along the outline of the substrate body 2 formed in the substrate forming region 11, protective plated layers 5 are formed on side faces of the two slots 13, and the slots 13 cut off the insulating members 6 embedded in the holes 12 along their continual direction. Thus, the substrate body 2 is not slipped off from the insulating substrate material 10 by the insulating members 6 regardless of formation of the slots 13 and the substrate body 2 is separated from the insulating substrate material 10 after the side faces of the slots 13 are covered with the protective plated layers 5 and parts of the insulating members 6. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009188285(A) 申请公布日期 2009.08.20
申请号 JP20080028417 申请日期 2008.02.08
申请人 CASIO COMPUT CO LTD 发明人 USUI NORIHISA
分类号 H05K3/00 主分类号 H05K3/00
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