| 摘要 |
There is provided a test apparatus having a test head containing test modules for sending/receiving signals to/from a device-under-test, a device mounting section having a socket for mounting the device-under-test and a performance board placed on the test head to connect each terminal of the test module with each terminal of the device-under-test via the device mounting section, and the performance board has a plurality of sub-boards each containing a part of a plurality of wires for connecting the test module with the device-under-test and a fixing section for attaching and fixing the plurality of sub-boards in a body to the test head.
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