发明名称 PATTERN FORMING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
摘要 A pattern forming method for forming a pattern serving as a mask, includes a process for forming a first pattern 105, a process for trimming a width of the first pattern 105, a process for forming a boundary layer 106 on a surface of the first pattern 105, a process for forming a second mask material layer 107 on a surface of the boundary layer 106, a process for removing a part of the second mask material layer 107 to expose top portions of the boundary layer 106, and a process for exposing the first pattern 105 and forming a second pattern having the second mask material layer 107 at a top portion thereof by etching the boundary layer 106.
申请公布号 US2009209105(A1) 申请公布日期 2009.08.20
申请号 US20090370868 申请日期 2009.02.13
申请人 TOKYO ELECTRON LIMITED 发明人 YAEGASHI HIDETAMI;SHIMURA SATORU;HAYAKAWA TAKASHI
分类号 H01L21/3105;G03F1/00;G03F7/40;H01L21/027;H01L21/3065;H01L21/311 主分类号 H01L21/3105
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