| 摘要 |
There is provided a light chip and an optical module with high reliability. The light chip 100 according to the present invention is a light chip having a semiconductor laser formed on a first substrate and includes a cavity 18 having an emission surface 22 on the upper surface, a first electrode 24 and a second electrode 26 for driving the semiconductor laser, and a plurality of pad portions 24a, 26a, for flip-chip bonding to a second substrate, respectively connected to the first electrode and the second electrode, wherein the cavity is, seen in a plan view, formed outside a region 25 formed by connecting the outermost peripheries of the plurality of pad portions by straight lines.
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