| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress deterioration with time such as corrosion of an interface portion between a thermal type infrared sensor and an external control circuit and wire breaking of the infrared sensor itself. <P>SOLUTION: A package of an infrared sensor is constituted of the thermal type infrared sensor having its principal surface covered with an infrared transmissive window to be sealed, a substrate mounted with the infrared sensor, a first frame body disposed on an outer periphery of the infrared transmissive window, a second frame body disposed on the substrate to enclose the infrared sensor, and a potting agent filling the gap between the first frame body and second frame body and having its surface in contact with the first frame body. Moisture hardly reaches a wire connection portion for electric connection. Therefore, wire connections and a pad portion can be improved in humidity resistance to provide the package of the infrared sensor which is compact and has superior durability. <P>COPYRIGHT: (C)2009,JPO&INPIT |
