NORMAL TEMPERATURE JOINING METHOD AND NORMAL TEMPERATURE JOINING DEVICE

摘要

A normal temperature joining method for joining substrates at a normal temperature through intermediate members comprises a step of forming the intermediate member on the surfaces to be joined of the substrates by physically sputtering targets and a step of activating the surfaces to be joined with an ion beams. The target to be physically sputtered is preferably made of a plurality of kinds of materials. Since the materials of the intermediate member are sputtered from the targets placed in various direction viewed from the surfaces to be joined of the substrates, the intermediate member can be uniformly formed on the surfaces to be joined. Further, since the intermediate member is made of a plurality of kinds of materials, normal temperature joining of substrates which are hard to join even if an intermediate member is made of a single kind of material is possible without heating them during joining and without excessive press-bonding. ® KIPO & WIPO 2009