发明名称 METHOD OF MANUFACTURING LAMINATED PLATE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated plate, capable of suppressing the generation of appearance defects such as wrinkles even if a press-heat-molding temperature is≥350°C upon the thermal lamination when manufacturing the laminated plate such as a flexible printed circuit board. SOLUTION: In the method, the laminated plate is manufactured by gluing a plurality of materials to be laminated by a press-heat-molding apparatus, which materials at least comprise three layers of (a) a non-thermoplastic polyimide film, (b) a layer of a thermoplastic and/or heat-press-bondable adhesive agent, and (c) a metal layer (foil). A buffer consisting of a felt comprising a heat-resistant fiber is arranged between the pressurizing face of the apparatus and the materials for to be laminated and the press-heat-molding is conducted at 350-500°C. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009178885(A) 申请公布日期 2009.08.13
申请号 JP20080018592 申请日期 2008.01.30
申请人 TOYOBO CO LTD 发明人 OKAMOTO ATSUSHI;OKUYAMA TETSUO;MAEDA SATOSHI
分类号 B29C43/20;B29C43/32;B29C65/02;H05K1/03;H05K3/00 主分类号 B29C43/20
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