发明名称 MANUFACTURING METHOD OF INSULATING SHEET SUBSTRATE, AND MANUFACTURING METHOD OF MULTILAYER CIRCUIT BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of an insulating sheet substrate in which working precision of a pattern formed using droplets is improved, and the manufacturing method of a multilayer circuit board. <P>SOLUTION: A carrier sheet 45 is used which has, on a coating surface 45a, a pattern 45P for transfer corresponding to a liquid pattern, ceramic slurry CS is supplied onto the coating surface 45a of the carrier sheet 45 to form the drawing surface of a ceramic green sheet 32 on the coating surface 45a of the carrier sheet 45, and the ceramic green sheet 32 is peeled from the carrier sheet 45 to form a protective pattern enclosing a drawing area on the drawing surface of the ceramic green sheet 32. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009182146(A) 申请公布日期 2009.08.13
申请号 JP20080019728 申请日期 2008.01.30
申请人 SEIKO EPSON CORP 发明人 MIURA HIROTSUNA
分类号 H05K3/10;H05K3/46 主分类号 H05K3/10
代理机构 代理人
主权项
地址