| 摘要 |
<p>Disclosed is a resist ink having improved heat resistance and crack resistance. Also disclosed is a method for manufacturing a multilayer printed wiring board having a partially exposed inner layer, wherein the resist ink is used. Specifically disclosed is a resist ink containing at least one member selected from the group consisting of tetracarboxylic acids, tetracarboxylic acid dianhydrides and half esterified tetracarboxylic acid dianhydrides, a polyhydric alcohol having three or more hydroxyl groups in a molecule, and a filler. The resist ink is soluble in an alkaline solution.</p> |
