| 摘要 |
PROBLEM TO BE SOLVED: To secure the forming region of a circulation gas discharge hole without narrowing the forming region of a processing gas discharge hole, to make the adjusting range of the conductance of a circulation gas wider than before, and to substantially adjust the flow rate of the circulation gas. SOLUTION: The vacuum processing apparatus comprises a mounting base 300 for mounting a substrate G inside a processing chamber 200, a processing gas supply mechanism 230 for supplying a processing gas from a processing gas supply source 232 into the processing chamber, a shower head 210 with a processing gas discharge hole for discharging the processing gas to the substrate G, a gas exhaust and circulation mechanism 400 for discharging a gas inside the processing chamber to the outside and returning a part of the discharged gas into the processing chamber as the circulation gas, and a circulation gas discharge part 240 with a circulation gas discharge hole for discharging the returned circulation gas to the substrate. The shower head is mounted so as to face the mounting base, and the circulation gas discharge part is disposed so as to surround the periphery of the mounting base. COPYRIGHT: (C)2009,JPO&INPIT
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