发明名称 SEMICONDUCTOR LASER ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor laser element capable of improving heat dissipation of an element end surface while maintaining reflection characteristics of an end face coating film at an oscillation wavelength. SOLUTION: The semiconductor laser element 1 has a thermally conductive film 22 made of Al<SB>2</SB>O<SB>3</SB>formed between the end surface 20 of a laser element body P and an antireflective film 10. The thickness T<SB>3</SB>of the thermally conductive film 22 satisfies T<SB>3</SB>=λ/2n<SB>3</SB>, whereinλis the oscillation wavelength of the semiconductor laser element 1 and n<SB>3</SB>is the refractive index of the thermally conductive film 22 to the wavelengthλ. With this constitution, the semiconductor laser element 1 speedily conducts heat generated through light absorption of an active layer 12 etc., to the outside via the thermally conductive film 22 to improve the heat dissipation. This contributes to improvement in reliability of the semiconductor laser element 1. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009182052(A) 申请公布日期 2009.08.13
申请号 JP20080018005 申请日期 2008.01.29
申请人 SUMITOMO ELECTRIC IND LTD 发明人 ICHIKAWA HIROYUKI
分类号 H01S5/028;H01S5/12 主分类号 H01S5/028
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