| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing carrier reducing a variation in a finish of polishing of a workpiece, and reducing a polishing processing time, and also to provide a polishing device. <P>SOLUTION: The polishing carrier 2 has a holding hole 13 for holding the workpiece 8, and is used for polishing a surface of the workpiece to be polished by sliding motion between the workpiece and the polishing surface, while introducing a polishing material between them, in a state of being sandwiched between an upper polishing surface (polishing cloth 7a) of an upper polishing plate 3 and a lower polishing surface (polishing cloth 7b) of a lower polishing plate 4. A plurality of projection parts 14 are provided on at least a surface (lower surface) opposed to a lower polishing surface, and thereby space C is formed for allowing the polishing material to be flown between the lower polishing surface and the lower surface of the carrier. <P>COPYRIGHT: (C)2009,JPO&INPIT |
