| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing apparatus equipped with a dehumidification means of performing efficient dehumidification. SOLUTION: The wafer processing apparatus includes a pressure reduction pipe 30 which places a chuck table 26 in air sucking operation and a dehumidifying device 80 which dehumidifies compressed air supplied to air bearing mechanisms of cutting units 47 and 57. The dehumidifying device 80 is supplied with purging air for discharging water separated through the dehumidification to the outside, and compressed air discharged from the pressure reduction pipe 30 and cutting units 47 and 57 is recycled as the purging air. Loss such that part of the compressed air having been dehumidified is used as the purging air is not generated unlike before to make the dehumidification efficient. COPYRIGHT: (C)2009,JPO&INPIT |
