MANUFACTURING METHOD OF ELECTRIC CIRCUIT DEVICE, ELECTRIC CIRCUIT DEVICE, AND METAL MOLD DEVICE

摘要

The purpose is to satisfy requests for miniaturization, weight reduction, narrowing pitches, easiness of design changes such as circuit changes, material yields, and correspondence to large current at as a high level as possible. There are provided a step of wiring an electric wire (12) in a metal mold (40), a step of manufacturing a wiring body module having the electric wire (12) embedded in a resin by pouring the fluidized resin into the metal mold (40) and solidifying it, and a step of mounting an electric component on the wiring body module.