| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a flexible base material having superior peeling strength, without using a metal vapor-deposited film with nickel and chromium possibly causing a migration as main components also without requiring two-time etching processes, and to provide a manufacturing method for the base material. <P>SOLUTION: The flexible base material is obtained, by forming an oxygen-containing copper film 2 and a copper film 3 containing no oxygen, in this order, on one side face of a polyimide film 1, also forming a copper plated layer 4 on the copper film containing no oxygen. The oxygen-containing copper film 2 has a film thickness of 5 nm or more and contains 5-20 at.% of oxygen and total 0.2-8 at.% of one or two kinds of elements selected from among a group consisting of Mo, Mn, Ca, Zn, Ni, Ti, Al, Mg and Fe, also balance copper with unavoidable impurities. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
