| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate that allows planarization of the surface/rear-face of a ceramic layer of the outermost layer, where the end face of a via conductor is exposed, even if the via conductor continuously penetrates through a plurality of ceramic layers while allowing highly-accurate mounting or the like of each electronic component on the surface/rear-face, and its manufacturing method. SOLUTION: The wiring substrate 1a includes a substrate body 2, which includes the surface 3 and the rear face 4 and is formed by laminating a plurality of ceramic layers S1-S4 including ceramic layers respectively formed with a through-hole h, a via hole 10, which is opened in the surface 3 of the substrate body 2 and in which a plurality of the through-holes h are continuous along in the thickness direction of the substrate body 2, a via conductor V, which is filled in the through-hole, being one of the plurality of through-holes h constituting the via hole 10, in the ceramic layer S1 of the outermost layer forming the surface 3 of the substrate body 2, and a through-hole conductor T that is formed along the inner-wall face of the through-hole, being one of the plurality of through-holes h forming the via hole 10, in the ceramic layer S2 other than the ceramic layer S1 of the outermost layer. COPYRIGHT: (C)2009,JPO&INPIT |
