发明名称 METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE
摘要 <p>A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.</p>
申请公布号 EP2084786(A1) 申请公布日期 2009.08.05
申请号 EP20070844156 申请日期 2007.10.11
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 SATO, YOSHIAKI;KAWATE, KOHICHIRO;HARA, TOMIHIRO;KIKUCHI, NORIKO
分类号 H05K3/36 主分类号 H05K3/36
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