发明名称 STRUCTURE OF ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a structure of an electronic apparatus in which wiring boards are provided on both sides of a heatsink, and the wiring between wiring boards does not damage the heat dissipation effect of the heatsink. SOLUTION: The heatsink 2 is stored inside a housing 1, and wiring boards 5 are provided on both sides of the heatsink. A potion which is opposed to at least the surface of the housing in which the wiring boards of the heatsink is not provided is made into a double wall structure. The wiring boards are electrically connected to each other through a cable 11 inserted into the space of the double wall structure. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009170760(A) 申请公布日期 2009.07.30
申请号 JP20080008924 申请日期 2008.01.18
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 ASO TOMOAKI
分类号 H05K7/20;H05K1/14 主分类号 H05K7/20
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