Verfahren zum Herstellen einer Schaltungsanordnung auf einem Substrat

摘要

The invention relates to a circuit arrangement (1) which is arranged on a substrate (4), which comprises a semi-conductor component (2) which is disposed on the substrate and provided with a control contact (21), at least one additional semi-conductor component (3) which is disposed on the substrate and an additional control contact (31) and at least one electric control contact resistor (5) which is arranged between the control contacts for electrically decoupling the control contacts. The semi-conductor components are connected in a parallel manner. At least one deposition (51) is arranged on the substrate and at least one electrically conductive material is provided in order to form the electric control contact resistance. The invention also relates to a method for producing said circuit arrangement comprising the following steps: a) the semi-conductor component and the additional semi-conductor component element are arranged on the substrate, and the control contact of the semi-conductor component and the additional control contact of the additional semi-conductor component face away from the substrate and b) the deposition is produced on the substrate and the control contact resistance is formed. Preferably, the semi-conductor components are power semi-conductor components such as, MOSFET, IGBT or bipolar transistors.