| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board module which can reduce adverse effects caused by radiation between a brittle circuit vulnerable to unnecessary radiation and the other circuits and also reduce radiation to the outside of a module as a whole, and to provide electronic equipment provided with the same. SOLUTION: The circuit board module includes: a substrate 1 having a mounting surface; a first electronic part and a second electronic part 3 which are mounted to the mounting surface, respectively; a first frame 4 with conductivity which surrounds the first electronic part 2 and the second electronic part 3 and is mounted to the mounting surface; a second frame 5 with conductivity which surrounds the second electronic part 3 and is mounted to the mounting surface inside the first frame 4; a first resin section 6 which is close to the first electronic part, the mounting surface, the first frame 4, and the second frame 5 between the first frame 4 and the second frame 5; a second resin section 7 which is close to the mounting surface of the second electronic part 3 and the second frame 5 inside the second frame 5; a first cover 8 with conductivity which covers the first electronic part and the second electronic part 3 and the second frame 5 and is connected to the first frame 4; and a second cover 9 which covers the second frame 5, being connected at the contact point of the second frame 5. COPYRIGHT: (C)2009,JPO&INPIT
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