| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board having a line/space not larger than 25/25μm, excelling in copper foil adhesion force, and having an extra-fine wire circuit. SOLUTION: After peeling off carrier metal foil on a surface of a copper-clad laminate formed by sticking copper foil which eliminates unevenness of a surface of a mat with a carrier metal foil as copper foil of the copper-clad laminate having at least two or more copper layers, and wherein the thickness of the copper foil is not larger than 2μm and the average roughness Rz of the unevenness on the mat surface is 2-4μm, the extra-fine wire circuit is manufactured by a pattern plating method. For a small-diameter hole, a blind via hole and/or a through-hole is formed by emitting pulse energy of a carbon dioxide gas laser enough to process the copper foil, preferably, one energy selected from energy of 3-19 mJ directly to the copper-clad laminate. This printed wiring board allowing the small-diameter hole to be formed by directly emitting the carbon dioxide gas laser without applying a copper foil surface treatment, excelling in copper foil adhesion force, and formed with the extra-fine wire circuit with a good yield can be provided. COPYRIGHT: (C)2009,JPO&INPIT
|
