| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate and its manufacturing method that can obtain high-density wiring on a double-sided substrate that can suppress a cost increase, can expand design freedom when designing a double-sided substrate, and can promote the further improvement of the quality of a product. SOLUTION: On a double-sided substrate 1, a plurality of through-holes 2 and wiring connected to one plated wiring 6 are collectively arranged in a narrow area near a connection part, and after the connection part has been plated, the plated through-holes 12 are formed and removed, and thus, each plated wiring 6 and each collectively-formed through-hole 2 become independent with no electrical conduction in each interval. COPYRIGHT: (C)2009,JPO&INPIT
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