| 发明名称 |
Method and apparatus for an improved upper electrode plate in a plasma processing system |
| 摘要 |
The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate.
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| 申请公布号 |
US7566368(B2) |
申请公布日期 |
2009.07.28 |
| 申请号 |
US20060567023 |
申请日期 |
2006.12.05 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAIGUSA HIDEHITO;TAKASE TAIRA;MITSUHASHI KOUJI;NAKAYAMA HIROYUKI |
| 分类号 |
C23C16/00;B05C11/00;C23C14/00;C23F1/00;H01J7/24;H01J37/32;H01L21/306;H05B31/26 |
主分类号 |
C23C16/00 |
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