METHOD OF PLANARIZING SUBSTRATE, ARRAY SUBSTRATE, AND METHOD OF MANUFACTURING ARRAY SUBSTRATE USING THE METHOD

摘要

A method for planarizing a substrate, an array substrate, and a method for manufacturing the same array substrate using a planarization method are provided to prevent a tangling effect of a succeeding layer formed on a metal electrode at a lateral surface of a metal line and a stepped part of a base substrate. An organic layer is formed to cover a metal line(12) which is formed on a base substrate(11). The organic layer is removed to expose the metal line. An auxiliary planarization layer is formed to planarize a surface of the base substrate including the metal line. A curing process is performed to cure the auxiliary planarization layer in order to shift the auxiliary planarization layer facing a lateral surface of the metal line to a lateral surface of the metal line. A planarization layer(13c) is formed by attaching the auxiliary planarization layer on the lateral surface of the metal line.