| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor apparatus removing a resin dam for damming the outflow of an underfill resin without stress. SOLUTION: After sticking the resin dam 8 for damming the outflow of the underfill resin 10 on a circuit board 2, the underfill resin 10 is filled in a gap between a semiconductor chip 1 and the circuit board 2. Then, after curing the filled underfill resin 10, by immersing the semiconductor apparatus 23 loaded with the resin dam 8 in a dissolution liquid 22 stored in a processing tank 21, the resin dam 8 is dissolved. COPYRIGHT: (C)2009,JPO&INPIT
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