| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer protective cover capable of protecting periphery portions of a wafer from a foreign material, and a wafer processing method. SOLUTION: The wafer protective cover 10 includes: a primary cover body 11 which is fitted with a part of periphery portions of a silicon wafer W; and a secondary cover body 12 which is fitted with a remaining part of the periphery portions. COPYRIGHT: (C)2009,JPO&INPIT |
