| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of minutely forming a conductive layer and excellent in electric reliability, its manufacturing method, and a packaging structure. SOLUTION: The wiring board 2 comprises an insulation layer 7, a via conductor 10 passing through the insulation layer 7, also having a part protruding from a surface of the layer 7 and having a recess D in a depth in the direction parallel to the surface of the layer 7, and a metallic layer 13 formed from the surface of the insulation layer 7 to an inner wall surface of the recess D and connected with the via conductor 10. COPYRIGHT: (C)2009,JPO&INPIT
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