发明名称 METHODS AND COMPOSITIONS FOR ELECTROPHORETIC METALLIZATION DEPOSITION
摘要 Embodiments of the invention generally provide methods and compositions that are used during electrophoretic deposition (EPD) processes. In one embodiment, a method for forming a metallization material during an EPD process is provided which includes positioning a substrate containing apertures disposed thereon, exposing the substrate to a flux agent to form a flux coating within the apertures, exposing the flux coating to an EPD mixture to form a particulate layer therein, and exposing the substrate to a reflow process to form a metallization layer within the apertures. Optionally, the particulate layer may be exposed to the flux agent prior to the reflow process. The EPD mixture generally contains a dielectric hydrocarbon fluid, metallic particles, and a liquid crystal material (LCM), such as a cholesteryl compound. In some embodiments, an abietic acid compound may be used as the flux agent, or alternatively, as the LCM.
申请公布号 US2009178927(A1) 申请公布日期 2009.07.16
申请号 US20080015410 申请日期 2008.01.16
申请人 WIJEKOON KAPILA P;WEIDMAN TIMOTHY 发明人 WIJEKOON KAPILA P.;WEIDMAN TIMOTHY
分类号 C25D13/02;C09K19/00;C09K19/32;C25D13/04 主分类号 C25D13/02
代理机构 代理人
主权项
地址