| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure which efficiently dissipates the heat of a heat generating component, to provide an electronic apparatus equipped with the heat dissipation structure, and to provide a manufacturing method of the heat dissipation structure. <P>SOLUTION: The heat dissipation structure 10 comprises a substrate 12, a case 13, and the heat generating component 11. The case 13 forms at least a portion of a container containing the substrate 12. The heat generating component 11 is mounted on the substrate 12 and constituted so as to include a component body 14 and a heat dissipation portion 16. The component body 14 generates heat by being applied with electricity. The heat dissipation portion 16 is thermally connected to the component body 14, the substrate 12 and the case 13 to dissipate the heat of the component body 14. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
