STACK PACKAGE AND METHOD FOR FABRICATING OF THE SAME

摘要

A stacked package and a method of manufacturing the same are provided, which can secure the junction simplicity and junction reliability by using the reflow process. Two or more semiconductor chips are stacked in the stacked package(100). A plurality of via holes(V) are equipped in order to be mutually detached from each other inside the semiconductor chip. The metal layer(120) is reclaimed inside the via hole so that the groove can be built from the lower-part of the semiconductor chip in a certain depth. The connection terminal(130) is adhered on the metal layer of the semiconductor chip upper face. The connection terminal is inserted within the groove of the semiconductor chip lower-part placed in the top and performs the electrical connection. The connection terminal is made of the conductive polymer or solder.