| 摘要 |
Provided is a method of manufacturing a heat-radiating substrate. The heat-radiating substrate includes a heat-radiating plate provided with a protruding heat sink pattern through etching, a dielectric layer and a copper thin layer, sequentially stacked on an etch region of the heat-radiating plate, and a circuit pattern disposed on the copper thin layer except for the heat sink pattern. The heat sink pattern, protruding for contacting a surface of a heating device, is formed on the metal heat-radiating plate having a high thermal conductivity, the dielectric layer and the copper thin layer are stacked on an etched rest, and then the circuit pattern is formed. The heating device directly contacts the heat-radiating plate, to improve heat-radiating performance. Since heat-radiating members such as cooling fans, heat sinks and heat-radiating resins of the related art are not used, the degree of freedom of design for miniaturization and slimness is greatly increased, and economical production is achieved according to a simple manufacturing method. |
