| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor module mounting structure that efficiently dissipates heat from both sides of the semiconductor module. <P>SOLUTION: A semiconductor module mounting structure 1 includes a wiring board 3 on which a semiconductor module 2 including a semiconductor device 21 and electrodes 22 exposed on both sides of the module in the thickness direction. The wiring board 3 is arranged with a ground wiring 31 for providing a ground potential such that at least part of the ground wiring 31 is exposed on a back side 302 opposite to a mounting side 301 on which the semiconductor module 2 is mounted. The exposed side 311 of the ground wiring 31 exposed to the back side 302 is thermally fixed to a heat radiator 4. The electrode 22s exposed to an opposite side 201 opposed to the wiring board 3 of the semiconductor module 2 is connected to the ground wiring 31 through a through-hole 32 provided in the wiring board 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
