发明名称 FILM-FORMING METHOD AND FILM-FORMING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a film-forming method which makes the thickness of a thin film uniform when a solution is jetted and applied to form the thin film. <P>SOLUTION: In the film-forming method, a solution is jetted and applied to a substrate, with dots whose diameters are smaller than the intervals between nozzles adjacent to each other, from a plurality of nozzles formed at prescribed intervals in a prescribed direction on a head. In this case, the method is provided with: a process in which the solution is jetted, with the dots, to the substrate from each of the nozzles; and a process in which the head and the substrate are relatively moved in the prescribed direction, and the part between a pair of dots, which is first jetted to the substrate from a pair of nozzles of prescribed interval, is completely painted with a plurality of dots. The part between the pair of dots, which is first jetted at a prescribed interval to the substrate, is completely painted with a plurality of dots in order in which the first jetted and applied dot is not adjacent to the last jetted and applied dot. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009148765(A) 申请公布日期 2009.07.09
申请号 JP20090092296 申请日期 2009.04.06
申请人 SHIBAURA MECHATRONICS CORP 发明人 SUZUKI HASHIO;TSURUOKA YASUJI;MATSUSHIMA DAISUKE
分类号 B05D1/26;B05C5/00;B05D3/00 主分类号 B05D1/26
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