| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor element easily applicable to different mounting configurations, even when they are different in semiconductor elements having the same functions, and to provide its manufacturing method. <P>SOLUTION: The semiconductor element 1000 has an internal circuit 142, an electrode 144 electrically connected to the internal circuit, a first semiconductor part 100 which covers the internal circuit and in which a first insulating layer 140 provided with the electrode exposed is provided, a wiring layer 210 electrically connected to the electrode and formed on the first insulating layer while having a first pad 211 and a second pad 213, and a second semiconductor element part 200 in which a second insulating layer 220 covering either one of the first pad or the second pad and exposing the other is provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
