HEAT-CURABLE RESIN COMPOSITION FOR LASER ENGRAVED ORIGINAL PRINTING PLATES

摘要

Disclosed is a heat-curable resin composition for laser engraved original printing plates that contains a resin composition (A) that includes (a) a resin with a number-average molecular weight of at least 1000 and no more than 300,000, (b) an organic compound with a number-average molecular weight of less than 1000 and possessing a polymerizable unsaturated group in the molecule, and (c) a thermal polymerization initiator. Here, the aforementioned resin (a) and/or the aforementioned organic compound (b) contains at least one compound with a carbonate bond in the molecule, and the aforementioned resin composition (A) is liquid at 20ºC.