发明名称 MOLD RELEASE FORCE MEASURING APPARATUS AND MOLD RELEASE FORCE MEASURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a mold release force measuring apparatus and a mold release force measuring method capable of measuring accurately a mold release force. SOLUTION: A first mold 11 with a first through-hole 11a, a first rod 12 inserted into the first through-hole 11a and sliding in the first through-hole 11a, a second through-hole 13a, a recessed part 13b surrounding the second through-hole 13a and with an opening larger than the first through-hole 11a, are provided. A second mold 13 overlapped on the first mold 11 so that the first mold 11 and the recessed part 13b oppose each other, and the first through-hole 11a and the second through-hole 13a oppose co-axially, and a brimmed first component 14 fitted to the recessed part 13b are provided on one end face. A second rod 15 inserted into the second through-hole 13a and sliding in the second through-hole 13a, an elastic body 16 hanging the second rod 15, and a distance detecting means 17 for obtaining a distance between the second mold 13 and the first component 14, are installed. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009148987(A) 申请公布日期 2009.07.09
申请号 JP20070329244 申请日期 2007.12.20
申请人 TOSHIBA CORP 发明人 DOI HATSUO
分类号 B29C43/32;B29C43/36;G01L5/00 主分类号 B29C43/32
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