发明名称 ULTRASOUND TRANSDUCER ASSEMBLY WITH IMPROVED THERMAL BEHAVIOR
摘要 A transducer assembly (10) is provided that includes a housing (12), a lens (14), an array of transducer elements (18), an interposer assembly (22), a transducer array 5 control assembly (30), and a heat sink assembly (32). The interposer assembly (22) includes a plurality of signals tracks (56) that provide electrical connections between the array of transducer elements (18) and the transducer array control assembly (30). The interposer assembly (22) further includes heat transporter bars (50) for transporting heat within the interposer (22) to the heat sink assembly (32). A flexible interconnection 10 assembly (28) is disposed between the interposer assembly (22) and the transducer array control assembly (30) providing re-workable electrical connections between the signal tracks (56) of the interposer assembly (22) and the transducer array control assembly (30).
申请公布号 WO2009083896(A2) 申请公布日期 2009.07.09
申请号 WO2008IB55498 申请日期 2008.12.22
申请人 KONINKLIJKE PHILIPS ELECTRONICS, N.V.;WEEKAMP, JOHANNES WILHELMUS;WIEGERINCK, GIDEON FREDERIK MARIA;VAN DE MOESDIJK, REMCO YURI;DAVIDSEN, RICHARD E. 发明人 WEEKAMP, JOHANNES WILHELMUS;WIEGERINCK, GIDEON FREDERIK MARIA;VAN DE MOESDIJK, REMCO YURI;DAVIDSEN, RICHARD E.
分类号 G10K11/00 主分类号 G10K11/00
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