发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus for measuring the etching quantity of the material being processed and detecting the end point of etching using optical interference on the surface of a sample being processed, so as to simultaneously achieve long life and ensuring of sufficient light to be received of a light introduction section, to enable long term stable operation and to improve the processing accuracy by accurate etching quantity detection. SOLUTION: In the plasma processing apparatus for processing a sample being processed by generating plasma between a shower plate and a lower electrode, a detector for detecting light from a surface of the sample being processed via the shower plate includes a light introduction section composed of a light guide into which light is entered and a spectroscope for analyzing the light obtained at the light introduction section, wherein the end surface of the light introduction section through which light is entered is arranged at a distance of five times or more the mean free path of gas molecules in the vacuum vessel from the end surface of the shower plate facing the plasma. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009152304(A) 申请公布日期 2009.07.09
申请号 JP20070327596 申请日期 2007.12.19
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 USUI TAKETO;YOSHIDA TAKESHI;MATSUMOTO TAKESHI;MUTO SATORU;YOKOGAWA KATANOBU
分类号 H01L21/3065 主分类号 H01L21/3065
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