发明名称 LEAD FRAME, ELECTRONIC COMPONENT WITH LEAD FRAME, AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method for improving defects caused due to the distortion of a lead frame or the like by protecting the three-dimensional structure of the lead frame when rewinding the three-dimensionally assembled lead frame. SOLUTION: In the lead frame for mounting an electric element, the lead frame is provided with a protector, and the size of the protector in the vertical direction is larger than the size in the vertical direction of the electric element mounted on the lead frame. The protector is integrated with the lead frame, and the protector is removed when cutting off the lead frame. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009147186(A) 申请公布日期 2009.07.02
申请号 JP20070324223 申请日期 2007.12.17
申请人 SANYO ELECTRIC CO LTD 发明人 MATSUOKA KEIKO;UMEDA MASASHI
分类号 H01L23/48;H01G4/228 主分类号 H01L23/48
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