<p>Provided is a technology of further reducing an on-resistance (or on-voltage) of a vertical semiconductor device having a carrier blocking layer. A semiconductor substrate (20) of a semiconductor device (10) is provided with a channel region (10A) and a non-channel region (10B). In the channel region (10A), an emitter region (26) which is brought into contact with a side surface of a trench gate (30) and electrically connected to an emitter electrode (28) is arranged. In a body region (25) of the non-channel region (10B), the emitter region (26) is not arranged. In the plan view, the ratio of an area occupied by the carrier blocking layer (52) arranged in the non-channel region (10B) to the non-channel region (10B) is higher than the ratio of an area occupied by the carrier blocking layer (52) arranged in the channel region (10A) to the channel region (10A).</p>
申请公布号
WO2009081667(A1)
申请公布日期
2009.07.02
申请号
WO2008JP70474
申请日期
2008.11.11
申请人
TOYOTA JIDOSHA KABUSHIKI KAISHA;NISHIDA, SHUICHI;OHNISHI, TOYOKAZU;SHOJI, TOMOYUKI