| 摘要 |
An organic/inorganic composite positive photoresist composition is provided to improve heat resistance and to obtain satisfactory smoothness and pattern stability. An organic/inorganic composite positive photoresist composition comprises 3 ~ 50 weight% of a binder resin represented by the formula 1; 2 ~ 40 weight% of a photosensitizer; 1 ~ 40 weight% of a dielectric constant control agent comprising a metal nitride or a metal oxide; and 10 ~ 94 weight% of an organic solvent, wherein R1, R2 and R3 are independently H or methyl; R4 is H, or C1~C14 alkyl, cycloalkyl or aromatic compound; and R5 is phenyloxy, phenyl, naphthyl, hydroxyphenyl, nitrile, C1~C14 alkoxycarbonyl, phenyloxycarbonyl or alkoxy. |
