| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device connecting terminals extending outward from a semiconductor module to a wiring board, wherein the terminals extending outward from the semiconductor module are connected to the wiring board by using a simple configuration without using screws and solder, without imparting strong stresses to the wiring board, and with a fully low contact resistance of connection. SOLUTION: The semiconductor device includes a semiconductor module casing 15, a metal terminal 10 extending outward from the inside of the casing, a semiconductor element 24 disposed in the casing and electrically connected to the metal terminal, and a wiring board 34 having a wiring pattern 36 on its surface and connected to the semiconductor package via the metal terminal. On the external portion of the casing, the metal terminal icludes a junction portion 12 which is in surface-contact with the external surface of the casing, and a resilient portion 11, disposed opposite to the junction portion, and separated by a space in between. The wiring board is sandwiched between the junction portion and the resilient portion, and the wiring pattern and the junction portion are metal-bonded by pressure welding. COPYRIGHT: (C)2009,JPO&INPIT |
