| 摘要 |
<p>A repair method for removing a component (22) from a substrate (21) is provided for an electronic component module having at least the substrate (21) and the component (22) fixed to the substrate (21) by a press-fit method. A repair block (31) having a repair through hole (32) is placed on the component (22). Then, a repair bolt (34) is fastened to a repair female screw (33) bored in the component (22) through the repair through hole (32). When the repair bolt (34) is further fastened even after the head part (35) of the repair bolt (34) abuts on the upper surface of the repair block (31), the component (22) is pulled up to the upper side of the substrate (21) with the repair female screw (33). If the repair female screw (33) cannot be bored directly in the component (22), a repair auxiliary component (23) to be pulled up together with the component (22) is interposed.</p> |
