发明名称 EXPANDING TAPE REMOVER OF WAFER FRAME
摘要 An expanding tape remover of a wafer frame is provided to reduce a cost by automatically removing an expanding tape. An expanding tape(5) is adhered to a wafer ring(2). The wafer ring is loaded in a wafer cassette(1). A loading unit(10) mounts the wafer cassette. A bar code reader(21) reads the bar code inside the expanding tape. A camera(22) captures a specific part inside a skeleton wafer(3). A tape remover removes the expanding tape. A working part(20) includes the tape remover. An unloading unit transfers the wafer ring to the loading unit to load the wafer ring in one direction.
申请公布号 KR20090070926(A) 申请公布日期 2009.07.01
申请号 KR20070139091 申请日期 2007.12.27
申请人 STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD. 发明人 KIM, SUK WEON;KIM, HYUN CHAN
分类号 H01L21/02;H01L21/48 主分类号 H01L21/02
代理机构 代理人
主权项
地址