发明名称 CONNECTING STRUCTURE USING ANISOTROPIC CONDUCTIVE FILM AND CHECKING METHOD OF CONNECTING CONDITION THEREOF
摘要 A connection structure body using an anisotropy conductive film and a connection state testing method thereof are provided to easily test an electric connection state between the first and second electrodes without respect to a kind of a member to be connected through two electrically divided second electrodes and a dummy electrode. The second member to be connected has a plurality of second electrodes. The second electrode is electrically divided into two. A dummy electrode(300) is symmetrically protruded in the divided end of the second electrode facing both ends of the first electrode(150). An anisotropy conductive film(400) is interposed between the first member to be connected and the second member to be connected. The anisotropy conductive film connects the first member to be connected with the second member to be connected.
申请公布号 KR20090068886(A) 申请公布日期 2009.06.29
申请号 KR20070136685 申请日期 2007.12.24
申请人 LG ELECTRONICS INC. 发明人 KIM, EUI HYUK;KIM, TAE HYUN
分类号 G02F1/133;G02F1/13 主分类号 G02F1/133
代理机构 代理人
主权项
地址